Setting the Stage. As AI workloads push the limits of compute scale, power efficiency, and bandwidth density, traditional die-to-die interconnect a ...

TES Electronic Solutions GmbH announces the availability of the Configurable Display Controller (CDC) IP core family, a scalable and modular solution designed to support a wide range of embedded ...

The boundaries between IP reuse, interconnect design, and hardware-software integration are no longer independent.

Vadzo Imaging introduces a practical interface selection guide to help OEMs choose between USB 3.2 camera, MIPI CSI-2 camera, ...

Photonics is rapidly becoming a key technology for AI in the datacentre to significantly reduce the power consumption of AI ...

New in-vehicle networking technology will likely take over as more AI is added, but in the near term designers face ...

To maintain low latency and fully utilize PCIe 7.0 bandwidth under parallel workloads, a more flexible ordering model is ...

Explore how vertical power delivery enhances efficiency by embedding components within PCBs and reducing power losses.

From software exits to real asset overweights, James Rodda explains the trades, risks and themes shaping Antipodes’ portfolio ...

CIEN stands out against NOK as AI-driven demand fuels record revenue, a nearly $7B backlog and strong hyperscaler spending ...

The military communications domain is undergoing a structural transformation, driven by the rapid increase in connectivity ...

WyreStorm introduced the EX-100-KVM-8K and EXF-10KM-5K The new products target professional AV installations that need longer ...