Abstract: Low resistance Cu interconnects with CVD Ru liner have been demonstrated for 7 nm node. Ru liner thickness reduction has been achieved by replacing PVD TaN with a bilayer PVD Ta and ALD TaN ...
This R package is served for analyzing OK-Seq data from original mapping bam file to count matrices, RFD calculation, and inititation/termination zone calling ...
Abstract: Fully subtractive TopVia Ru interconnects with embedded airgap have been demonstrated through spacer assisted litho-etch litho-etch (SALELE) patterning, which utilizes a novel spacer pull ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results