Avatar Medical has obtained FDA clearance for its software that transforms CT and MRI scans into interactive 3D anatomical models for use in surgical planning and visualization. The system supports ...

Prosthodontics is undergoing a digital revolution, with technologies like CAD/CAM, 3D printing, and AI transforming how dental restorations are designed and delivered. These innovations improve ...

Keysight Technologies has introduced a new software tool aimed at tackling the growing complexity of 3D interconnect design in high‑density chiplet and 3DIC packages. 3D interconnect design tool ...

SANTA ROSA, Calif. -- Keysight Technologies, Inc. (NYSE: KEYS) today introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the ...

BILBAO, SPAIN, January 27, 2026 /EINPresswire.com/ — SealPath, a global leader in Zero-Trust Data-Centric Security and Enterprise Digital Rights Management (DRM ...

CEPT University and Tvasta Manufacturing Solutions have partnered to establish an advanced additive manufacturing workshop, positioning CEPT as a leading academic hub for automated concrete ...

Prior to today's global debut, Tencent's open-sourced Hunyuan 3D Models have earned worldwide acclaim and popularity among developers and creators In addition, Tencent Cloud, the cloud business of ...

Prior to today's global debut, Tencent's open-sourced Hunyuan 3D Models have earned worldwide acclaim and popularity among developers and creators HONG KONG, Nov. 25, 2025 /PRNewswire/ -- Tencent ...

Global semiconductor equipment company Lam Research announced on the 14th that it will introduce deposition equipment for advanced packaging and strengthen collaboration with the domestic ...

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures Addresses Manufacturing Pain ...

To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established the "3DIC ...