SAN JOSE, Calif. — Cadence Design Systems Inc. will release a platform this week that can model the high-speed interconnect of an entire system, from ICs through packages to pc boards. Allegro takes ...
Looking to help designers work together more effectively — from those who design chips to those who make boards — Cadence Design Systems Inc. today announced a new interconnect design platform.
Precise accuracy and higher throughput for 3D analysis of complex high-speed interconnects enables more robust designs When analyzing MIPI camera sensor signals with their legacy solution, LTTS was ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Global Unichip Corporation (GUC) successfully deployed the Cadence ® Clarity ā„¢ 3D Solver in its ...
SAN JOSE, CA--(Marketwire - Oct 16, 2012) - Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that TSMC has selected Cadence® solutions for ...
January 25, 2013. At the European 3D TSV Summit in Grenoble, France, on January 22-23, 2013, imec announced that together with Cadence Design Systems they have developed, implemented, and validated an ...