Micron said its next-gen HBM4 memory will debut in 2026 while current HBM3E chips already power Nvidia's top AI systems, ...

Researchers have demonstrated that the layered multiferroic material nickel iodide (NiI2) may be the best candidate yet for devices such as magnetic computer memory that are extremely fast and compact ...

Micron Technology Inc., the largest US maker of computer memory chips, gave an upbeat forecast for the current quarter, ...

We all know AI has a power problem. On the whole, global AI usage already drew as much energy as the entire nation of Cyprus did in 2021. But engineering researchers at the University of Minnesota ...

December Nasdaq 100 E-Mini futures (NQZ25) are trending up +0.30% this morning as optimism over artificial intelligence was reinforced by Alibaba’s pledge to boost spending and an upbeat forecast from ...

Driven by strong AI demand, memory contract prices for NAND and DRAM rose sharply by an estimated 15-20% in the fourth ...

Lam Research Corporation is a $17 billion wafer-fabrication equipment maker. They are simulating and designing next generation computer memory. Its products are used primarily in front-end wafer ...

A computer memory device that can withstand temperatures of more than 500°C could be used in spacecraft sent to explore Venus or the sun. Computers use a technology called non-volatile memory to store ...

A pioneering type of patented computer memory known as ULTRARAM™ has been demonstrated on silicon wafers in what is a major step towards its large-scale manufacture. ULTRARAM™ is novel type of memory ...