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Ansys Collaborates with TSMC to Deliver Thermal Analysis Solution for 3D-IC Designs

The companies collaborated to deliver a comprehensive hierarchical thermal analysis solution for TSMC 3DFabric using RedHawk-SC Electrothermal TSMC enabled Ansys RedHawk-SC™ for power integrity (EM/IR ...
Engineering

We Understand the Heat Behind Thermal Desktop and Ansys

Ten years ago, it would have been difficult to predict the electrification trend in the automotive industry and almost impossible to predict the smart capabilities of everything else. When thermostats ...
BIOENGINEER

New Simulation Framework Validates Coupled Neutronic and Thermal-Hydraulic Analysis for Nuclear Thermal Propulsion

Researchers at the Georgia Institute of Technology have developed and validated a new computational framework for simulating ...
Nasdaq

Ansys 3D-IC Power Integrity and Thermal Solutions Certified for TSMC 3Dblox Reference Flow

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
Semiconductor Engineering

Accurate Thermal Analysis, Including Thermal Coupling Of On-Chip Hot Interconnect

Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power ...